TeledyneDALSA

This role spanned mechanical engineering responsibilities across multiple high-precision camera programs for semiconductor and gene sequencing applications.

Details

On the Wrangler gene sequencing CMOS camera and Lotus mask/wafer inspection CCD camera, served as lead and sole mechanical engineer respectively, covering full design ownership including DFMA, tolerance analysis, and GD&T. For Lotus, a helium leak test was also developed to verify the camera’s ability to sustain a 10⁻⁶ Torr vacuum environment. The most technically demanding work was on a mask/wafer inspection CMOS array camera, where the focus was precision sensor alignment. Working with an optical physicis, I led the mechanical design of a sensor alignment system achieving ±50μm XY and ±2.2 mDeg rotation specifications (~10X better than prvious sensor arrays). Designed vacuum seals for a 10⁻⁶ Torr environment using low-outgassing materials meeting TML <1% and CVCM <0.1%. Designed and executed a comprehensive test campaign covering sensor rotation during screwing (proven repeatable at 1.6 mDeg), M1.6 preload retention through creep and 99 thermal cycles, and 10G shock testing for transit alignment retention. Also designed an automated end-effector with a vacuum chuck capable of simultaneously driving six M1.6 screws with ±0.5mm compliance, and managed a vendor for an environmental control system holding alignment tooling to ±0.1°C. Additional work included ANSYS Sherlock training for PCB lifetime simulations, thermal simulations in ANSYS Icepak that reduced fan size and enclosed volume by 40% for a camera power supply, and completion of formal GD&T training on ASME Y14.5 2009.

Company
Teledyne DALSA
Date
Mar 2023 - Aug 2025
Role
Mechanical Engineer
Tags
ANSYSOpto-MechanicsOptical SystemsAutomationCMOSCCDDUVEUV